Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry

A multi-electronic device package comprising:

• a first substrate having a first surface and an opposed second surface;
• a first layer of electrically conductive circuitry formed on said first surface of said first substrate;
• a second layer of electrically conductive circuitry formed on said second surface of said first substrate, wherein said second layer of circuitry is electrically coupled to said first layer of circuitry, and wherein said second layer of circuitry is adapted for electrical coupling to a third external circuitized substrate;
• a first electronic device secured to said first substrate and electrically coupled to said first layer of circuitry;
• a second substrate having a first surface and an opposed second surface;
• a third layer of electrically conductive circuitry formed on said first surface of said second substrate;
• a second electronic device coupled to said second substrate, said second electronic device electrically coupled to said third layer of circuitry;
• a fourth layer of electrically conductive circuitry formed on said second surface of said second substrate, wherein said fourth layer of circuitry is electrically coupled to said third layer of circuitry;
• a first encapsulant covering said first electronic device and a portion of said first layer of circuitry;
• and
• wherein said encapsulant is bonded to said second substrate;
• and
• wherein said second substrate includes a cavity extending from said second surface of said second substrate partially into said second substrate, and wherein said first and second substrates are bonded together along a common interface such as that said second surface of said second substrate faces said first surface of said first substrate and at least a portion of said encapsulant extends into said cavity to thereby decrease the distance between said second surface of said second substrate and said first surface of said first substrate.