US 5,963,428 A · Cooling cap method and apparatus for tab packaged integrated circuit

Abstract

The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.

Claims5

Dependent claims

A method of cooling a component, comprising the steps of:

providing a cooling cap and a plurality of bolts, wherein the cooling cap comprises a first thermally conductive material and wherein each bolt includes a raised portion;
attaching the component to a circuit board, wherein the component includes a plurality of leads and wherein the circuit board includes a component-mounting surface and a plurality of traces, wherein the step of attaching includes establishing an electrical connection between one of the leads and one of the traces;
determining a maximum possible gap between the attached component and the cooling cap;
depositing an amount of second thermally conductive material needed to bridge the maximum possible gap between the attached component and the cooling cap;
and
rigidly suspending said cooling cap over the circuit board such that a thermally conductive path extends from the component through the second thermally conductive material to the cooling cap and such that weight from the cooling cap is transferred to the circuit board rather than falling on the component, wherein the step of rigidly suspending includes:
mounting said cooling cap on said raised portion of said bolts such that the weight of said cooling cap is supported by said raised portion of said bolts;
and
releasing the cooling cap;
wherein the cooling cap, when released, remains in thermal contact with the component without lifting the component from the circuit board.

7 more elements

Dependencies are inferred from the claim text.

Cooling cap method and apparatus for tab packaged integrated circuit

Life of this patent

Cooling cap method and apparatus for tab packaged integrated circuit

Life of this patent

Abstract

Claims5