LC aligning substrate by rubbing the surface of the substrate with a roller while slightly vertically vibrating the roller and the substrate
AssigneeKabushiki Kaisha Toshiba
InventorsMitsuru Ishibashi, Hideyuki Sasaki, Tatsuo Nomaki, Shigeki Terada, Hirofumi Ishii
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Abstract
An LC aligning substrate (3) is used for an LCD. The substrate is rubbed with a roller (5). The roller has irregularities on the surface thereof, or instead, one of the roller and substrate is vertically vibrated. As a result, the orientation of molecules at the surface of the substrate is finely changed to conceal sharp changes in the orientation of the surface molecules, thereby preventing the LCD from displaying defective rubbing stripes.
Claims6
A method processing an LC aligning substrate, comprising the step of:
- rubbing the surface of the LC aligning substrate with a roller having irregularities on the surface thereof, to provide alignment variation on the surface of the LC aligning substrate, wherein the irregularities on the roller are provided at heights of 0.05 mm to 0.5 mm and arranged so that the alignment variation on the surface of the LC aligning substrate is reccurent at cycles of 0.1 mm to 5.0 mm.
A method of processing an LC aligning substrate, comprising the step of:
- rubbing the surface of the LC aligning substrate with a roller while slightly vertically vibrating one of the roller and LC aligning substrate, to provide alignment variation on the surface of the LC aligning substrate.
An LC aligning substrate rubbed with a roller, comprising reflected infrared absorbance difference that shows periodic and successive changes of 0.0002 or over at intervals of 0.1 mm to 5.0 mm in a rubbing direction, the reflected infrared absorbance difference serving as an index of the orientation of surface molecules of the LC aligning substrate and being measured by emitting two polarized rays in and orthogonal to the rubbing direction toward the surface of the LC aligning substrate, detecting the absorbances of reflected infrared rays from the LC aligning substrate, and calculating the difference between the absorbances at the characteristic absorption wavelength of the LC aligning substrate.
A method of processing an LC aligning substrate, comprising:
- rubbing the surface of the LC aligning substrate with a roller having irregularities on the surface thereof, to form irregularities on the surface of the LC aligning substrate, wherein the irregularities on the roller are provided at heights of 0.05 mm to 0.5 mm and arranged so that the irregularities on the surface of the LC aligning substrate are reccurent at cycles of 0.1 mm to 5.0 mm.
Dependencies are inferred from the claim text.