Ink jet recording head and method of forming an ink jet recording head

An ink jet recording head comprising:

• a substrate having a plurality of ejection energy generating elements for ejecting ink;
• a wiring board electrically connected at a first connecting region to an electric connection pad on said substrate and functioning to apply a voltage to said ejection energy generating elements;
• a plate combined with said substrate, said plate being provided with a groove constituting an ink passage when the plate is combined with said substrate, there being a second connecting region between said substrate and said plate, said substrate having a projection at a position between said second connecting region and the pad, said first connecting region is sealed by a first resin sealing material, and the second connecting region is sealed by a second resin sealing material;
• wherein said projection between said second connecting portion and the pad provides a boundary between the first resin sealing material and the second resin sealing material.

A method of forming an ink jet recording head manufacturing method, comprising the steps of:

• providing a substrate having a plurality of ejection energy generating elements for ejecting an ink and a projection;
• a wiring board electrically connected to an electric connection pad on said substrate and functioning to apply a voltage to said ejection energy generating element;
• a plate combined with said substrate, said plate being provided with a groove which defines an ink passage when the plate is combined with said substrate;
• electrically connecting, using a first connecting portion, said substrate and said wiring board
• sealing said first connecting portion using a first sealing material;
• and
• connecting said substrate and said plate by sealing a second connecting portion between said substrate and said plate using a second sealing material, the projection of the substrate being disposed at a position between said second connecting portion and the pad, the connecting of the substrate and the plate taking place after the electric connecting between said substrate and said wiring board and the sealing of said first connecting portion are performed.