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US 5,963,039 AGranted
Testing attachment reliability of devices
AssigneeLucent Technologies Inc.
InventorsRichard Borutta, John J. Burack, Michael V. Occhipinti, John C. Manock
Life of this patent
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AssigneeLucent Technologies Inc.
InventorsRichard Borutta, John J. Burack, Michael V. Occhipinti, John C. Manock
Estimating the term…
An apparatus for testing the attachment reliability of a device mounted at least by an electrically conducting joint to a surface of a circuit board is provided. The apparatus includes an environmental chamber in which the board can be placed; an actuator for applying a force to the device; an electrical monitoring unit for monitoring any events at the electrically conducting joint; and a memory unit for storing an event profile that includes information related to the events. The apparatus may further include a processing unit for characterizing the quality of the electrically conducting joint based on the stored event profile and for performing various other functions. A method for testing the attachment reliability of the device is also provided.
An apparatus for testing the attachment reliability of a plurality of devices, wherein each of said plurality of devices is mounted by at least an electrically conducting joint to a surface of a circuit board, said apparatus comprising:
A method for testing the electrical and mechanical reliability of a plurality of devices, wherein each of said plurality of devices is mounted by at least one electrically conducting joint to a surface of a circuit board, said method comprising:
Dependencies are inferred from the claim text.