Emitter structure of field emission cold-cathode device using synthetic resin substrate
AssigneeKabushiki Kaisha Toshiba
InventorMasayuki Nakamoto
Life of this patent
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Abstract
A field emission cold-cathode device has a supporting substrate, and an emitter for emitting electrons disposed on the supporting substrate. The supporting substrate is essentially formed of a transparent synthetic resin. The emitter is formed by molding a portion of a conductive material layer such as Au which has been disposed on the supporting substrate into a conical shape. The conductive material layer functions also as a cathode wiring. An engaging concave portion is formed on a surface of the emitter to be bonded with the supporting substrate. In conformity with this engaging concave portion, a convex portion is integrally formed on the supporting substrate so as to be hermetically fitted in the engaging concave portion.
Claims10
An emitter structure of a field emission cold-cathode device, comprising:
- a supporting substrate;
- and
- an emitter arranged on said supporting substrate, said emitter consisting essentially of a conductive material having a projection tapering toward a distal end on a front side of the emitter for emitting electrons and a concave portion bonded with an integral convex portion of said supporting substrate on a back side of the emitter, said integral convex portion being hermetically fitted with said concave portion, and
- wherein said supporting substrate consists essentially of a synthetic resin selected from a group consisting of thermoplastic resins, ultraviolet-curing resins, and thermosetting resins and said convex portion is molded in said synthetic resin with said concave portion being used as a mold.
An emitter structure of a field emission cold-cathode device, comprising:
- a supporting substrate;
- and
- an emitter arranged on said supporting substrate, said emitter consisting essentially of a thin layer of a conductive material, having a projection tapering toward a distal end on a front side of the emitter for emitting electrons, and a concave portion bonded with an integral convex portion of said supporting substrate on a back side of the emitter, said integral convex portion being hermetically fitted with said concave portion, and
- wherein said thin layer has a thickness smaller than a depth of said concave portion and is shaped to be a cap defining said projection and said concave portion by associated top and bottom surfaces, respectively, and
- wherein said supporting substrate consists essentially of a synthetic resin, selected from a group consisting of thermoplastic resins, ultraviolet-curing resins, and thermosetting resins and said convex portion is molded in said synthetic resin with said concave portion being used as a mold.
Dependencies are inferred from the claim text.