Microbridge superconductor device utilizing stepped junctions

A microbridge superconductor device, comprising:

• a substrate having an inclined substrate surface, the inclined substrate surface dividing the substrate surface into a lower planar substrate surface and an upper planar substrate surface;
• a lower layer of an anisotropic superconductor material, having an a-axis and a c-axis, epitaxially deposited on the lower planar substrate surface so that the a-axis of the anisotropic superconductor material of the lower layer is exposed at a top edge of the lower layer;
• an upper layer of an anisotropic superconductor material epitaxially deposited on the upper planar substrate surface so that the a-axis of the anisotropic superconductor material of the upper layer is exposed at a top edge of the upper layer;
• and
• a layer of a non-superconductor material overlying the inclined substrate surface and the layers of the anisotropic superconductor material.

A microbridge superconductor device, comprising:

• a substrate having an inclined substrate surface, the inclined substrate surface dividing the substrate surface into a lower planar substrate surface and an upper planar substrate surface;
• and
• a loop on the substrate surface that intersects the inclined substrate surface at two junction locations, the loop comprising
• a superconductor layer of an anisotropic superconductor material epitaxially deposited overlying the lower planar substrate surface with the c-axis not perpendicular to the plane of the lower substrate surface and the upper planar substrate surface with the c-axis not perpendicular to the plane of the upper substrate surface, and
• a layer of normal material deposited overlying the inclined substrate surface and contacting the superconductor layer at the two junction locations.