Molding resin, composition containing the same, and process for producing them
AssigneeTosoh Corporation
InventorsShigehiko Abe, Hiroshi Furuta
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AssigneeTosoh Corporation
InventorsShigehiko Abe, Hiroshi Furuta
Estimating the term…
A molding resin having improved processability is disclosed, comprising a copolymer of ethylene and an .alpha.-olefin having 3 to 12 carbon atoms and having the following properties (a) a weight average molecular weight Mw to number average molecular weight Mn ratio (Mw/Mn) of 3 or less as determined by gel permeation chromatography; (b) a density of 0.850 to 0.980 g/cm.sup.3 ; (c) a melt flow rate of 0.5 to 5 g/10 min as measured at 190.degree. C. under a load of 2,160 g according to JIS K7210, Condition 4; (d) a slope S of storage modulus G' in a frequency region of from the frequency (f.sub.c) at which storage modulus G' and loss modulus G" agree with each other to f.sub.c /10, which is obtained from the frequency dependence of dynamic viscoelasticity, i.e., .DELTA.log G'/.DELTA.log f, of more than 0.70 and less than 0.90; and (e) an activation energy of flow .DELTA.H of 35 kJ/mol or less as obtained at 160 to 220.degree. C.
A molding resin comprising a copolymer of ethylene and 1-hexene, said resin having the following properties:
A resin composition comprising a molding resin and an antioxidant, said molding resin comprising a copolymer of ethylene and 1-hexene and having the following properties:
Dependencies are inferred from the claim text.