Polymer for chemical amplified positive photoresist composition containing the same

Abstract

A positive chemical amplified photoresist composition comprising as a matrix resin a polymer having the repeating unit of Formula (I) and a photoacid generator. The polymer ranges, in polystyrene-reduced weight average molecular weight, from about 2,000 to 1,000,000. The photoresist composition is possible to develop in alkali and shows excellent sensitivity, resolution and transmissivity to deep uv light in addition to being superior in storage preservativity. The repeating unit is: ##STR1## wherein, R.sub.1, R.sub.2 and R.sub.3 are independently represented by a hydrogen atom or a methyl group; R.sub.4 is a hydrogen atom, an alkyl group or an alkoxy group; R.sub.5, R.sub.6 and R.sub.7 are independently represented by a hydrogen atom, a methyl group, an ethyl group, a t-butyl group, a tetrahydropyranyl group or an alkoxymethylene group; j is an integer of 1-8; k is an integer of 0-8; and l, m and n each represent a mole ratio, satisfying the condition of 1=0.1.about.0.5/l+m+n, m=0.3.about.0.8/l+m+n, n=0.1.about.0.4/l+m+n and l+m+n+l. The acid labile protective group can be the t-butyl group, the tetrahydropyranyl group or the alkoxymethylene group.

Dependencies are inferred from the claim text.