Solder, electronic component mounted by soldering, and electronic circuit board
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAtsushi Yamaguchi, Kenichiro Suetsugu, Tetsuo Fukushima, Akio Furusawa
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Abstract
The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
Claims8
Solder powder whose surface of a solder core containing tin is coated with one of indium (In) and bismuth (Bi).
Solder wire in which a solder core containing tin is coated around the circumference of flux, and the circumference of said solder core is coated with one of indium (In) and bismuth (Bi).
An electronic component whose one of lead-frame surface and electrode surface is coated with a solder containing indium, wherein said indium in alloy composition after the solder is melted is 6 weight percentage and below.
An electronic circuit board whose copper (Cu) land surface is coated with a solder containing indium, wherein said indium in alloy composition after the solder is melted is 6 weight percentage and below.
Dependencies are inferred from the claim text.