Integrated circuit device and process for its manufacture
AssigneeInternational Business Machines Corporation
InventorsHugh Ralph Brown, Kenneth Raymond Carter, Hyuk-Jin Cha, Richard Anthony Dipietro, James Lupton Hedrick, John Patrick Hummel, Robert Dennis Miller, Do Yeung Yoon
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Abstract
The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.
Claims12
An integrated circuit device comprising:
- (a) a substrate;
- (b) metallic circuit lines positioned on the substrate, and
- (c) dielectric composition positioned contiguous to the circuit lines, the composition comprising the reaction product of organic polysilica and polyamic ester terminated with (RO).sub.m (R").sub.n SiR'-- where R and R' are independently a hydrocarbyl group;
- R" is hydrido or hydrocarbyl group;
- m is, 1, 2 or 3 and n+m=3.
An integrated circuit packaging device for providing signal and power current to an integrated circuit chip comprising:
- (i) a substrate having electrical conductor for connection to a circuit board,
- (ii) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least one of the layers comprises the reaction product of organic polysilica and polyamic ester terminated with (RO).sub.m (R").sub.n SiR'--, where R and R' are independently a hydrocarbyl group;
- R" is hydrido or hydrocarbyl group;
- m is 1, 2 or 3 and n+m=3;
- and
- (iii) a plurality of vias for electrically interconnecting electrical conductor, conducting layers and an integrated circuit chip.
Dependencies are inferred from the claim text.