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US 5,962,097 AGranted
Protective member for semiconductor wafer
AssigneeNitto Denko Corporation
InventorsShoji Yamamoto, Kazuhiko Yamamoto
Life of this patent
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Abstract
A protective member for a semiconductor wafer wherein a pressure-sensitive adhesive layer formed on a protective film is temporarily adhered to a separator comprising a reinforcing layer and a cover layer, through the cover layer. The separator of the protective member does not require a surface treatment with a release agent and in processing a semiconductor wafer, such as back-surface grinding, the protective film can be automatically peeled and is adhered to the semiconductor wafer via an automatic adhering apparatus to enable the desired processing.
Claims4
A semiconductor wafer protective member comprising:
- A) a semiconductor wafer protective layer,
- B) a pressure-sensitive adhesive layer formed on one side of the protective layer, and
- C) a separator comprising a reinforcing layer and a cover layer formed on at least one side of the reinforcing layer, wherein the separator is temporarily adhered to the pressure-sensitive adhesive layer through the cover layer;
- and
- wherein the cover layer a homopolymer of comprises polyethylene.
2 more elements
Dependencies are inferred from the claim text.