Pulse laser induced removal of mold flash on integrated circuit packages
AssigneeNational University of Singapore
InventorsYong Feng Lu, Daniel Siu Hung Chan, Teck Seng Low
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Abstract
A dry process to remove mold flash on integrated circuit packages (IC packages) by using pulse, short wavelength laser irradiation. The mold remnants on the surface or in holes of the lead frame can be removed by pulse laser irradiation, with the effect of thermal expansion of lead frame metals and momentum transferring from the laser beam to the mold remnants. Compared with conventional water jet or etching processes, the new technique has high productivity and does not degrade the reliability of the IC packages, due to the fact that there is no water or chemical solutions involved in the process.
Claims17
A short wavelength laser apparatus for removing mold flash from a substrate, comprising:
- a short wavelength pulse laser generator, wherein a wavelength of a laser beam generated by said pulse laser generator is less than 550 nm;
- an aperture through which said laser beam generated by said pulse laser generator is passed;
- a focusing lens for focusing said laser beam after said laser beam passes through said aperture;
- a transparent holding means for holding a substrate while the substrate is treated with a focused laser beam;
- and
- a monitoring laser means for monitoring the removal of mold flash from said substrate, said monitoring laser means including a monitoring laser generator disposed on one side of said transparent holding means, a photodetector disposed on an opposite side of said transparent holding means, a first convex lens disposed on said one side of said transparent holding means, and a second convex lens disposed between said transparent holding means and said photodetector;
- wherein
- said laser beam removes mold flash by both heating the mold flash and providing a momentum pressure force upon the mold flash.
A method for removing mold flash from a substrate using a short wavelength laser, comprising the steps of:
- generating a short wavelength pulse laser beam having a wavelength less than 550 nm;
- passing said short wavelength pulse laser beam through an aperture;
- holding said substrate on a transparent substrate holder;
- focusing said pulse laser beam on a portion of mold flash to be removed from said substrate by passing said pulse laser beam through a focusing lens after said pulse laser beam passes through said aperture, such that said pulse laser beam removes mold flash from said substrate by both heating and providing a momentum pressure force upon the mold flash;
- and
- monitoring the removal of mold flash from said substrate, said monitoring including utilizing a monitoring laser generator disposed on one side of said transparent substrate holder, a photodetector disposed on an opposite side of said transparent substrate holder, a first convex lens disposed on said one side of said transparent substrate holder, and a second convex lens disposed between said transparent substrate holder and said photodetector.
A short wavelength laser apparatus for removing mold flash from a substrate, comprising:
- a short wavelength pulse laser generator, wherein a wavelength of a laser beam generated by said laser generator is less than 550 nm;
- a focusing lens for focusing said laser beam;
- a transparent holding means for holding a substrate while the substrate is treated with a focused laser beam;
- and
- a monitoring laser means for monitoring the removal of mold flash from said substrate, said monitoring laser means including a monitoring laser generator disposed on one side of said transparent holding means, a photodetector disposed on an opposite side of said transparent holding means, a first convex lens disposed on said one side of said transparent holding means, and a second convex lens disposed between said transparent holding means and said photodetector;
- wherein
- said pulse laser beam removes mold flash by both heating the mold flash and providing a momentum pressure force upon the mold flash.
A method for removing mold flash from a substrate using a short wavelength laser, comprising the steps of:
- generating a short wavelength pulse laser beam having a wavelength less than 550 nm;
- holding said substrate on a transparent substrate holder;
- focusing said pulse laser beam on a portion of mold flash to be removed from said substrate by passing said pulse laser beam through a focusing lens such that said pulse laser beam removes mold flash from said substrate by both heating and providing a momentum pressure force upon the mold flash;
- and
- monitoring the removal of mold flash from said substrate, said monitoring including utilizing a monitoring laser generator disposed on one side of said transparent substrate holder, a photodetector disposed on an opposite side of said transparent substrate holder, a first convex lens disposed on said one side of said transparent substrate holder, and a second convex lens disposed between said transparent substrate holder and said photodetector.
Dependencies are inferred from the claim text.