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US 5,961,768 AGranted
Apparatus for applying adhesive sheets
AssigneeLintec Corporation
InventorMasaki Tsujimoto
Life of this patent
Estimating the term…
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AssigneeLintec Corporation
InventorMasaki Tsujimoto
Estimating the term…
The adhesive sheet is a three-layered construction formed from a base material, a plyimide base resin adhesive and a release film, and is outputted from a sheet output control portion. A plate-shaped material comprised of semiconductor wafer is placed on a bonding table, and the wafer is heated by a heater unit. The bonding table is moved to the upper position, then a press roller is moved to press the adhesive sheet onto the heated wafer so as to bond the adhesive sheet to the wafer. At such time, another press roller presses the adhesive sheet. Then, a cutting unit is lowered to cut away any excess adhesive sheet material from the outer periphery of the wafer. Then, such excess adhesive sheet material is wound up in a sheet wind-up portion. In the next step, the rear surface of the wafer is stuck to a dicing tape, and then each chip is cut out. After this is done, each chip is picked up from the dicing tape and die bonded to a lead frame via the adhesive sheet.
A method of applying an adhesive sheet which includes a thermoplastic resin to a plate-shaped material, comprising the steps of:
A method of applying an adhesive sheet which includes a thermoplastic resin to a plate-shaped material, comprising the steps of:
An apparatus for applying an adhesive sheet which includes a thermoplastic resin to a plate-shaped material, comprising:
An apparatus for applying an adhesive sheet which includes a thermoplastic resin to a plate-shaped material, comprising:
Dependencies are inferred from the claim text.