Ultrasound signal processing electronics with active cooling

An ultrasound transducer structure, comprising:

• an ultrasound transducer operable to generate and receive ultrasonic energy;
• a communication cable;
• integrated circuits for processing signals received from said ultrasound transducer;
• at least one flexible circuit substrate for connecting said communication cable to said integrated circuits, and for further connecting said integrated circuits to said ultrasound transducer;
• a housing for containing said ultrasound transducer, said integrated circuits and said at least one circuit substrates;
• a heat sink within said housing and in contact with each of said integrated circuits, said heat sink including an enclosed chamber;
• and
• fluid transfer means in contact with said heat sink, for feeding a heat transfer fluid to and through said enclosed chamber in said heat sink so as to conduct heat generated by said integrated circuits and transferred to said heat sink to a further heat transfer position.

An ultrasound transducer structure, comprising:

• an ultrasound transducer operable to generate and receive ultrasonic energy;
• a communication cable;
• integrated circuits configured to process signals received from said ultrasound transducer;
• at least one flexible circuit substrate connecting said communication cable to said integrated circuits, and further connecting said integrated circuits to said ultrasound transducer;
• a housing containing said ultrasound transducer, said integrated circuits and said at least one circuit substrate;
• a heat sink including an enclosed chamber within said housing and in contact with each of said integrated circuits;
• and
• fluid transfer ducts coupled to said enclosed chamber of said heat sink and configured to feed air to and through said enclosed chamber so as to conduct heat generated by said integrated circuits to a further heat transfer position.