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US 5,961,378 AGranted
Polishing apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorTakao Inaba
Life of this patent
Estimating the term…
Abstract
A polishing apparatus is provided with a turn table, on which an air passage is formed, and a polishing pad mount plate, on which a polishing pad is stuck. The polishing pad mount plate is detachably attached on the turn table. When the polishing pad mount plate is detached from the turn table, a separation fluid supplying part supplies air as separation fluid between the turn table and the polishing pad mount plate through the air passage.
Claims4
A polishing apparatus comprising:
- a polishing table;
- a polishing pad mount plate on which a polishing pad for polishing a polished material is attached, said polishing pad mount plate being detachably attached on said polishing table;
- a separation fluid passage formed on at least one of said polishing table and said polishing pad mount plate;
- a separation fluid supplying part which supplies separation fluid between said polishing table and said polishing pad mount plate through said separation fluid passage when said polishing pad mount plate is detached from said polishing table;
- and
- a polishing pad mount plate moving part which moves said polishing pad mount plate in a direction to become farther from said polishing table and supports said polishing pad mount plate when said polishing pad mount plate is detached from said polishing table.
3 more elements
Dependencies are inferred from the claim text.