Method of making high density integrated circuit module

A method of manufacturing a high density integrated circuit module of the type which includes TSOP devices and improved electrical interconnect integrity, comprising the steps of:

• a) forming a high density integrated circuit module comprised of a plurality of vertically stacked level-one integrated circuit TSOP devices, wherein each said level-one TSOP device within said module includes an integated circuit die and a plurality of electrical leads extending from said die;
• b) providing a plurality of rails, wherein each said rail includes a substrate mounting portion, said rails being adapted to electrically and thermally connect selected leads from said level-one TSOP devices;
• c) reforming said electrical leads on selected level-one TSOP device wherein the act of reforming said electrical leads on selected level-one TSOP devices includes the act of inverting the leads on a first level-one TSOP device by inverting the first level-one device with respect to any other TSOP devices within the module;
• and
• d) electrically and thermally connecting a reformed lead to a selected rail to form a rail connection.