Printed circuit board

A method for manufacturing a printed circuit board, comprising the steps of:

• A. laminating first and second cover films onto opposed surfaces of a resin impregnated fabric sheet,
• B. forming first and second through holes in the direction of the thickness of the sheet and first and second cover films,
• C. filling the first through holes with an electrically conductive paste that contains electrically conductive particles and a thermosetting resin and filling the second through holes with an electrically insulative paste that contains thermally conductive, electrically insulative particles and a thermosetting resin,
• D. removing the first and second cover films,
• E. placing a metallic foil on the opposed surfaces of the sheet, pressing and heating the sheet, and hardening the resin impregnated in the fabric sheet, the thermosetting resin in the electrically conductive paste, and the thermosetting resin in the electrically insulative paste, and
• F. etching the metallic foil, thereby removing a portion of the foil that blocks the second through hole and forming the metallic foil into a predetermined circuit pattern.

A method for manufacturing a printed circuit board, comprising the steps of:

• A. laminating first and second cover films onto opposed surfaces of a resin impregnated fabric sheet,
• B. forming first, second and third through holes in the direction of the thickness of the sheet and cover films,
• C. filling the first and second through holes with an electrically conductive paste that contains electrically conductive particles and a thermosetting resin and filling the third through holes with an electrically insulative paste that contains thermally conductive, electrically insulative particles and a thermosetting resin,
• D. removing the first and second cover films,
• E. placing a metallic foil on the opposed surfaces of the sheet, pressing and heating the sheet, and hardening the resin impregnated in the fabric sheet, the thermosetting resin in the electrically conductive paste, and the thermosetting resin in the electrically insulative paste, and
• F. etching the metallic foil, thereby removing portions of the foil that block the second and third through holes, forming the metallic foil into a predetermined circuit pattern, further etching to remove the electrically conductive particles present at a surface layer portion of the second through hole, thereby forming an electrically insulating layer comprised of the thermosetting resin on the second through hole.