Method for the preparation of a wiring circuit board for mounting of a semiconductor

Abstract

Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.

Dependencies are inferred from the claim text.