Radiation sensitive resin composition
AssigneeJsr Corporation
InventorsIsao Nishimura, Masayuki Endo
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Abstract
A radiation sensitive resin composition comprising (A) a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a cross-linkable compound; and (D) an organic solvent. The composition suitable is useful for a negative resist for forming a mask for the production of a circuit such as a semiconductor integrated circuit or a thin film transistor circuit for liquid crystal displays as well as a material for forming a permanent film such as an interlaminar insulating film or a color filter protective film.
Claims14
A radiation sensitive resin composition comprising:
- (A) a fluorine-containing copolymer of (a-1) hexafluoropropylene, (a-2) at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and (a-3) an unsaturated compound copolymerizable with the components (a-1) and (a-2);
- (B) an acid generating compound which generates an acid upon exposure to radiation;
- (C) a cross-linkable compound;
- and
- (D) an organic solvent in which the components (A), (B) and (C) are dissolved.
Dependencies are inferred from the claim text.