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US 5,958,607 AGranted
Lead frame for semiconductor device
AssigneeSamsung Aerospace Industries, Ltd.
InventorsJoong-do Kim, Young-ho Baek
Life of this patent
Estimating the term…
Abstract
A lead frame has a metal substrate directly coated with a palladium alloy layer to prevent diffusion of metal molecules from the metal substrate. The lead frame does not contain a nickel intermediate layer, thereby preventing the diffusion of nickel molecules which makes soldering difficult, and enhancing production.
Claims4
A lead frame comprising:
- a metal substrate including one of Cu and Cu alloy;
- and
- a Pd--Au alloy layer coated directly on said metal substrate to a predetermined thickness within a range of 0.1 to 1.0 .mu.m.
Dependencies are inferred from the claim text.