Circuit board and method of manufacturing the same

A circuit board comprising:

• a thick film wiring board;
• and
• a thin film layer formed on said thick film wiring board;
• said thick film wiring board is electrically connected to said thin film layer through a first thick film conductor pattern and a first thin film conductor pattern;
• a first insulator is formed on said first thick film conductor pattern in such a manner that said first thin film conductor pattern partially passes through said first insulator and is brought in contact with said first thick film conductor pattern;
• an area of a portion of said first thick film conductor pattern which portion is exposed from a front surface of said thick film wiring board is larger than an area of a portion of said first thin film conductor pattern which portion is in contact with said first thick film conductor pattern;
• and
• the portion of said first thick film conductor pattern which portion is exposed from the front surface of said thick film wiring board is formed in an approximately square shape.

A circuit board comprising:

• a thick film wiring board having a first conductor pattern;
• and
• a thin film layer laminated on said first conductor pattern;
• wherein said thin film layer comprises:
• a first insulator on said first conductor pattern;
• a second insulator on said first insulator;
• a second conductor pattern formed on said first insulator in such a manner as to partially pass through said first insulator and to be electrically connected to said first conductor pattern;
• a wiring pattern for circuit correction formed on said first insulator;
• and
• a third conductor pattern passing through said second insulator and electrically connected to said second conductor pattern.