Hybrid substrate for cooling an electronic component
AssigneeMotorola, Inc.
InventorsDetlef Schmidt, Martin R. Pais
Life of this patent
Estimating the term…
Abstract
The substrate (10) has a first side (12) and a second side (14) and includes an insert material (16) having a first thermal conductivity (24) in a first direction (25) and having a second thermal conductivity (26) in a second direction (27). A plurality of vias (30) are formed in the second direction through the insert material and an encapsulant material (18) surrounds the insert material. When an electronic component (22) is disposed on the first side, heat (25) from the electronic component is conducted in the first direction by the insert material and is conducted in the second direction through the plurality of vias.
Claims11
A substrate for receiving and cooling an electronic component, the substrate having a first side and a second side, the substrate comprising:
- an insert material having a first thermal conductivity in a first direction and having a second thermal conductivity in a second direction;
- a plurality of vias formed through the insert material, the vias formed in the second direction;
- and
- an encapsulant material surrounding the insert material,
- when an electronic component is disposed on the first side, heat from the electronic component conducted in the first direction by the insert material and conducted in the second direction through the plurality of vias.
A substrate comprising:
- a first material having a high thermal conductivity in a first direction and having a lower thermal conductivity in a second direction, the second direction normal to tho first direction,
- a plurality of vias extending through the first material and configured to conduct heat in the second direction;
- and
- a second material encapsulating the first material, the second material deposited by disposing the first material in a silicon carbide preform to form an assembly, then injecting liquid aluminum into the assembly,
- the liquid aluminum penetrating the silicon carbide preform to form aluminum silicon carbide (AlSiC) and the liquid aluminum filling the plurality of vias.
Dependencies are inferred from the claim text.