Printed circuit boards
AssigneeMurata Manufacturing Co., Ltd.
InventorsHitoshi Tsuji, Koji Nishi
Life of this patent
Estimating the term…
Abstract
On a surface of an insulating board, a front wiring pattern is formed. On the rear surface of the insulating board, opposing the front wiring pattern, a rear wiring pattern is formed in a shape which is substantially plane-symmetrical to the front wiring pattern. An opening which penetrates the front wiring pattern and the rear wiring pattern is formed. At the inner wall of the opening, an electrically conductive layer is formed. Inside the opening, solder, for example, is placed to form an electrically conductive filling. As a result, the front wiring pattern and the rear wiring pattern are positively connected to each other electrically. Therefore, the current capacity and the heat capacity of the wiring patterns are increased, and the amount of generated heat is reduced.
Claims26
A printed circuit board, comprising:
- an insulating board having opposing front and back surfaces;
- a front wiring pattern formed on said front surface, said front wiring pattern including at least one longitudinally extending section;
- a rear wiring pattern formed on said rear surface, said rear wiring pattern including at least one longitudinally extending section;
- one of said sections of said front wiring pattern opposing a corresponding one of said sections of said rear wiring pattern to form an opposing pair of longitudinally extending wiring pattern sections, each section of said pair being located opposite to and having substantially the same shape and size as the other section of said pair;
- a plurality of openings extending through said insulating board and penetrating both sections of said pair;
- and
- an electrically and thermally conductive material filling said openings so as to electrically and thermally couple said pair of wiring pattern sections.
A printed circuit board, comprising:
- an insulating board having opposed front and back surfaces;
- a front wiring pattern formed on said front surface, said front wiring pattern including at least one longitudinally extending section;
- a rear wiring pattern formed on said rear surface, said rear wiring pattern including at least one longitudinally extending section;
- a plurality of said sections of said front wiring pattern opposing a corresponding plurality of said sections of said rear wiring pattern to form a plurality of longitudinally extending opposing pairs of wiring pattern sections, each pair of wiring pattern sections comprising a respective section of said front wiring pattern and a respective section of said rear wiring pattern, each section of a given pair being located opposite to and having substantially the same shape and size as the other section of said pair;
- for each pair of wiring pattern sections, a respective plurality of openings extending through said insulating board and penetrating both wiring pattern sections of such pair;
- and
- an electrically and thermally conductive material filling said openings so as to electrically and thermally couple said pairs of wiring pattern sections.
Dependencies are inferred from the claim text.