Electrical components and method for the fabrication thereof
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsMinoru Isshiki, Katsutoshi Mine, Kimio Yamakawa
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AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsMinoru Isshiki, Katsutoshi Mine, Kimio Yamakawa
Estimating the term…
This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of: (i) a mixture of components (a) and (b), (ii) a reaction mixture of components (a) and (b), (iii) component (c), (iv) component (c) and a mixture of components (a) and (b), and (v) component (c) and a reaction mixture of components (a) and (b), where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.d where R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.
A method for fabricating electrical components having a surface of cured silicone thereon, comprising:
Dependencies are inferred from the claim text.