Tin-silver-based soldering alloy
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsJunichi Matsunaga, Ryuji Ninomiya
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Abstract
The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.
Claims10
A tin-silver-based soldering alloy consisting essentially of 3 to 4 wt. % Ag, 3 to 6 wt. % Bi, 2 to 6 wt. % In and the balance being Sn.
A tin-silver-based soldering alloy consisting essentially of 3 to 4 wt. % Ag, 2 to 6 wt. % Bi, 5 to 6 wt. % In and the balance being Sn.
A tin-silver-based soldering alloy consisting essentially of 4 wt. % Ag, 2 to 6 wt. % Bi, 3 to 6 wt. % In and the balance being Sn.
A tin-silver-based soldering alloy consisting essentially of 3.5 wt. % Ag, 2 wt. % Bi, 3 wt. % In and the balance being Sn.
Dependencies are inferred from the claim text.