High tensile strength electrodeposited copper foil and process of electrodepositing thereof
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsHisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi, Yasuji Hara
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Abstract
A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.
Claims6
A process of electrodepositing copper foil having a matte side roughness Rz of 2.5 .mu.m or less and atomic cells with a (111) orientation as measured by x-ray diffraction by electrodepositing of said copper foil from a copper solution containing copper ions, 0.01 to 0.10 g/l of a polyether glycol, 0.5 to 1.0 g/l of tin ions, 0.5 to 5.0 g/l of iron ions, and less than 0.1 mg/l chloride ion at a current density of about 30-100 A/dm.sup.2.
Dependencies are inferred from the claim text.