Fluxing media for non-VOC, no-clean soldering
AssigneeFord Global Technologies, LLC
InventorsGuilian Gao, Lakhi Nandlal Goenka
Life of this patent
Estimating the term…
Abstract
A flux formulation without a surfactant is used in the assembly of electronic circuit boards as a no-clean formulation. The formulation includes a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's). The method comprises the step of heating the flux solution and dispersing it as a fine spray.
Claims13
A flux formulation without a surfactant for use in the assembly of electronic circuit boards as a no-clean formulation, the formulation comprising:
- a flux solution having a fluxing agent consisting essentially of:
- one or more weak organic acids;
- and
- a solvent consisting essentially of water;
- the flux solution serving to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's);
- wherein the one or more weak organic acids consists of adipic acid having a solid content of up to 62.5% dissolved in water heated up to about 100.degree. C.
A flux formulation without a surfactant for use in the assembly of electronic circuit boards as a no-clean formulation, the formulation comprising:
- a flux solution having a fluxing agent consisting essentially of:
- one or more weak organic acids;
- and
- a solvent consisting essentially of water;
- the flux solution serving to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's);
- wherein the fluxing agent consists of adipic acid with a concentration of up to 160 grams of adipic acid per 100 milliliters of water at about 100.degree. C.
A flux formulation without a surfactant for use in the assembly of electronic circuit boards as a no-clean formulation, the formulation comprising:
- a flux solution having a fluxing agent consisting essentially of:
- one or more weak organic acids;
- and
- a solvent consisting essentially of water;
- the flux solution having up to about 62.5% of the one or more weak organic acids dissolved in water heated up to about 100.degree. C., and serving to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOC's).
Dependencies are inferred from the claim text.