Ultra-low particle semiconductor cleaner using heated fluids

A method for cleaning objects having surfaces, said method comprising the steps of:

• immersing an object in a heated liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 micron in diameter, said heated liquid being at a temperature ranging from about 25.degree. C. to about 80.degree. C.;
• and
• providing a substantially particle free environment adjacent to said face, said substantially particle free environment comprising a gas that is substantially free from particles greater than about 0.5 micron in diameter;
• and
• introducing a carrier gas comprising a cleaning enhancement said cleaning enhancement substance doping said liquid which is attached to said face to cause a concentration gradient of said cleaning enhancement substance in said attached liquid to accelerate fluid flow of said attached liquid off of said object, said cleaning enhancement substance comprising a non-saturated compound.

A method for cleaning objects having surfaces, said method comprising:

• immersing an object in a heated liquid comprising water, said object including a face, said water being substantially free from particles greater than about 0.5 microns, said heated liquid being at a temperature ranging from about 250 C. to about 800 C.;
• and
• providing a substantially particle free environment adjacent to said face, said substantially particle free environment being substantially free from particles greater than about 0.5 microns;
• wherein said liquid is removed at a selected rate of about 5.0 mm/sec. or less as measured from said face and is replaced by said substantially particle free environment, said substantially particle free environment accelerating fluid flow of attached liquid off of said face.