US 5,957,736 A · Electronic part

Abstract

An electronic part, particularly a microstructure contact having an overall length of the order of 5 mm for an electrical connector or the like is provided with a nickel oxide layer portion having a nickel oxide layer of the order of 50 to 5000 .ANG. in thickness formed by anode oxidizing process using a solution mainly consisting of an alkaline solution. The nickel oxide layer portion is located between a terminal portion of the electronic part to be soldered as in a surface mounting process and a contact portion continuous to and extending from the terminal portion. The nickel oxide layer has a width of the order of 0.2 to 1 mm in the longitudinal direction of the contact and has a performance preventing the flowing of molten solder, thereby effectively preventing the flowing and wicking due to wetting of solder of the solder-plated portion toward the other portions as in the surface mounting process.

Claims20

Dependent claims

An electronic part comprising a contact portion at one end thereof, a terminal portion at an opposite end thereof and a barrier portion therebetween contiguous with said contact portion and said terminal portion, said part including a coating thereon comprising nickel on at least said contact portion and said terminal portion, with a first overcoating on said contact portion to facilitate electrical contact and a second overcoating on said terminal portion to facilitate soldering of the part to a circuit board,

said barrier portion comprising a coating of nickel which has been converted to a layer of nickel oxide by anodizing the nickel coating in an alkaline solution between said overcoated contact portion and said overcoated terminal portion, said barrier portion inhibiting migration of molten solder between said terminal portion and said contact portion.

Dependencies are inferred from the claim text.

Electronic part

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Electronic part

Life of this patent

Abstract

Claims20