Lead frame unloading tool having sliding blocks

A lead frame unloading apparatus for manufacturing a semiconductor chip package device, said apparatus comprising:

• a pair of opposing plate members having fastening openings at their respective ends, one of said opposing plate members having a long horizontal slit between the fastening openings, said pair of opposing plate members having top and bottom surfaces bent inwardly so as to face each other, said opposing plate members defining a central space therein;
• a pair of blocking members, each of which is fixed to the respective ends of said two opposing plate members using a fixing means inserted into said fastening openings;
• one or more sliding blocks having a vertical through hole at its center, said one or more sliding blocks being disposed between said two opposing plate members;
• one or more pickers, each of which penetrates within said through hole of respective said one or more sliding blocks, when the one or more pickers contact a lead frame, the one or more pickers become immobilized, thereby allowing the one or more sliding blocks to move vertically up and down on the immobilized one or more pickers each of the pickers having a vacuum suction means at one end thereof, and a vacuum screw at the other end thereof, said vacuum screw having a hollow projection connected to a vacuum supplier;
• a spring disposed beneath respective of said one or more sliding blocks, said springs being fitted to an outside of said vacuum suction means of the pickers;
• respective spring stoppers for supporting the springs;
• and
• respective fastening means for fastening said one or more sliding blocks to the opposing plate members through said long horizontal slit,
• said lead frame apparatus being connected to a driving member, said picker picking up a lead frame from a lead frame stack, and said one or more sliding blocks being horizontally movable within the central space between said two opposing plate members by loosening and tightening the fastening means.