Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers

An automated local area semiconductor wafer fabrication system for automatically storing, loading and processing semiconductor wafers, comprising:

• a fabrication tool having at least a first load lock;
• a transfer chamber operatively coupled to said first load lock;
• and at least one process chamber operatively coupled to said transfer chamber;
• and
• an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising:
• a first load port adapted to receive a wafer carrier;
• a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool;
• a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool;
• a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool;
• and
• a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism;
• wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.

A factory automation system comprising:

• at least a first automated local area semiconductor wafer fabrication system comprising a fabrication tool comprising at least a first load lock;
• a transfer chamber operatively coupled to said first load lock;
• and at least one process chamber;
• and
• an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising:
• a first load port adapted to receive a wafer carrier;
• a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool;
• a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool;
• a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool;
• and
• a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism;
• wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.

A local interconnection of fabrication tools comprising:

• a first apparatus adapted to buffer wafer carriers to be loaded to a first fabrication tool comprising:
• a first load port adapted to receive a wafer carrier;
• a first vertical transfer mechanism disposed to elevate the wafer carrier to a height greater than that of the first fabrication tool;
• a first horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the first fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the first fabrication tool;
• a second vertical transfer mechanism operatively coupled to said first horizontal transfer mechanism at a location above the first fabrication tool and adapted to lower the wafer carrier from said first horizontal transfer mechanism to a position for loading into the first fabrication tool;
• and
• a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism;
• and
• a second apparatus adapted to buffer wafer carriers to be loaded to a second fabrication tool comprising:
• a third load port adapted to receive a wafer carrier;
• a third vertical transfer mechanism disposed to elevate the wafer carrier from the third load port to a height greater than that of the second fabrication tool;
• a second horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the second fabrication tool, and adapted to transfer the wafer carrier from a first side of the second fabrication tool to a second side of the second fabrication tool;
• a fourth vertical transfer mechanism operatively coupled to said second horizontal transfer mechanism at a location above the second fabrication tool and adapted to lower the wafer carrier from said second horizontal transfer mechanism to a position for loading into the second fabrication tool;
• and a fourth load port disposed to receive the wafer carrier from said fourth vertical transfer mechanism;
• wherein said first horizontal transfer mechanism and said second horizontal transfer mechanism are operatively coupled via said first horizontal transfer mechanism and said second horizontal transfer mechanism.