Method and apparatus for forming a ball in wire bonding
AssigneeKabushiki Kaisha Shinkawa
InventorsFumio Miyano, Kuniyuki Takahashi
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Abstract
In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes the portion of an electric spark facing the bonding wire to be bent and positioned beneath the bonding wire.
Claims3
A method for forming a ball in wire bonding, wherein a high voltage is applied across a tip end of a wire and a discharge electrode, which is positioned beside said tip end of said wire, so as to generate an electric discharge and form said ball on said tip end of said wire, said method being characterized in that a magnetic field is applied to a discharged spark so as to cause a portion of said discharged spark that faces said wire to be curved and positioned beneath said wire.
An apparatus for forming a ball in wire bonding, wherein a high voltage is applied across a tip end of a wire and a discharge electrode, which is positioned beside said tip end of said wire, so as to generate an electric discharge and form said ball on said tip end of said wire, said apparatus being characterized in that a magnet is provided which applies a magnetic field which causes a portion of a discharged spark that faces said wire to be curved and positioned beneath said wire.
Dependencies are inferred from the claim text.