IC leadframe processing system
AssigneeIshii Tool & Engineering Corporation
InventorMitoshi Ishii
Life of this patent
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Abstract
An IC leadframe processing system for use in an IC manufacturing system, whereby IC leadframes of different types can be subjected to various lead machining processes by a single processing system without a need of various types of cutting and bending dies. The topmost leadframe is separated by a separating device one by one from a stack of leadframes stored, each having a plurality of IC chips connected thereto. The leadframe is cut into each individual packaged IC by a leadframe cutting device. Lead wires of each packaged IC are subjected to pinch cutting, dam cutting and end cutting by a cutting die and then bent into a Z shape by a bending machine.
Claims9
An IC leadframe processing system utilized as a single processing system, comprising:
- storage means for storing a stack of leadframes each having a plurality of IC chips mounted thereon;
- separating means for separating the leadframes, one by one, from said stack of leadframes stored in storage means;
- leadframe cutting means for cutting said leadframes separated from said storage means each into individual IC chips to obtain a plurality of packaged ICs;
- machining means for machining lead wires of each of said individual packaged ICs;
- a lead processing machine table for transferring and angularly indexing said packaged ICs for said machining by said machining means;
- and
- transfer means for transferring said separated leadframes between said separating means and said leadframe cutting means and for transferring said packaged IC cut from said leadframes between said leadframe cutting means and said machining means.
Dependencies are inferred from the claim text.