Structures and methods for limiting current in ionizable gaseous medium devices

A method of making an addressing structure including a substrate of electrically nonconductive material having a series of spaced-apart plasma channels in one of its major surfaces, an ionizable gaseous medium in the plasma channels, a data element that stores a data signal, and first and second elongated electrodes extending lengthwise along each of the plasma channels, wherein a potential difference between the first and second elongated electrodes causes a discharge current to flow in the ionizable gaseous medium and provide an interruptible electrical connection between the data element and at least one of the first and second elongated electrodes to selectively address the data element, the method including making the first and second elongated electrodes by:

• forming first and second stripes of electrically conductive material lengthwise along each one of the plasma channels;
• performing cataphoresis to deposit a resistive layer onto the first stripe of conductive material in each plasma channel;
• and
• fusing the resistive layer to the first stripe of conductive material by air baking the substrate, the first stripe, and the resistive layer.

A method of making an addressing structure including a substrate of electrically nonconductive material, first and second elongated electrodes along a major surface of the substrate, an ionizable gaseous medium, and a data element that stores a data signal, wherein a potential difference between the first and second elongated electrodes causes a discharge current to flow in the ionizable gaseous medium and provide an interruptible electrical connection between the data element and at least one of the first and second elongated electrodes to selectively address the data element, the method including making the first and second elongated electrodes by:

• forming at least first and second parallel stripes of electrically conductive material along said major surface of the substrate;
• printing a resistive layer onto the first stripe of conductive material;
• and
• fusing the resistive layer to the first stripe of conductive material by air baking the substrate, the first stripe, and the resistive layer,
• and wherein the first electrode is substantially uniform in structure over substantially its entire length.