Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers

A thermoelectric conversion module comprising:

• a honeycomb structural body made of an electrically insulating material and having a first surface, a second surface opposing to said first surface, and a plurality of channels which extend from said first surface to said second surface, alternate one or more channels of said plurality of channels being classified into a first group and the remaining channels being classified into a second group;
• a plurality of electrically insulating filler members, each of which is provided in respective one of said channels of the honeycomb structural body and has formed therein a through hole extending from the first surface to the second surface of said honeycomb structural body;
• a plurality of N type semiconductor elements, each of which is provided in respective one of the through holes of said electrically insulating filler members formed in said channels belonging to the first group;
• a plurality of P type semiconductor elements, each of which is provided in respective one of the through holes of the electrically insulating filler members formed in said channels belonging to the second group;
• and
• metal electrodes provided on said first and second surfaces of the honeycomb structural body such that adjacent one or more N type semiconductor elements and one or more P type semiconductor elements provided in the channels belonging alternately to the first and second groups are connected in cascade by means of said metal electrodes.