Semiconductor device including nickel formed on a crystalline silicon substrate
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Jun Koyama, Satoshi Teramoto
Life of this patent
Estimating the term…
Loading patent…
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Jun Koyama, Satoshi Teramoto
Estimating the term…
In a MOS semiconductor device utilizing a crystalline silicon substrate, the formation of a parasitic channel is suppressed. A solution of nickel acetate is applied to a silicon substrate 101 to form a layer including nickel indicated by 102. Thermal oxidation is performed to form a field oxide film 103 for device separation. At this time, a halogen element is included in the atmosphere. At this step, the action of nickel suppresses the formation of defects at the interface between the oxide film 103 and a channel region 106 and in the vicinity thereof, thereby suppressing the formation of a parasitic channel. Further, as a result of the action of the halogen element, nickel is gettered into the thermal oxidation film 103.
A MOS semiconductor device having a crystalline semiconductor substrate, said device comprising:
A semiconductor device comprising:
An electronic apparatus having semiconductor devices comprising an oxide layer formed in a crystalline semiconductor substrate and a single crystalline semiconductor layer formed on said oxide layer, said apparatus comprising:
Dependencies are inferred from the claim text.