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US 5,945,334 AGranted
Apparatus for packaging a chip
AssigneeAffymetrix, Inc.
InventorsDonald M. Besemer, Virginia W. Goss, James L. Winkler
Life of this patent
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Abstract
A body 300 having a cavity 310 for mounting a chip 120 fabricated with probe sequences at known locations according to the methods disclosed in U.S. Pat. No. 5,143,854 and PCT WO 92/10092 or others, is provided. The cavity includes inlets 350 and 360 for introducing selected fluids into the cavity to contact the probes. Accordingly, a commercially feasible device for use in high throughput assay systems is provided.
Claims10
An apparatus for packaging a chip, said apparatus comprising:
- a chip having a first surface and a second surface, said first surface comprising a probe array and said second surface being an outer periphery of said first surface;
- a body having a mounting surface, an upper surface, and a cavity bounded by said mounting surface and said upper surface, said second surface being attached to said cavity and said first surface being within said cavity;
- a cover attached to said mounting surface for defining an upper boundary to said cavity;
- a first channel fluidly coupled to said cavity, the first channel having a diffuser portion that tapers outward towards said cavity for dispersing fluid as the fluid passes into the cavity;
- and
- a second channel fluidly coupled to said cavity, the second channel having a concentrator portion that tapers outward towards said cavity for collecting fluid as the fluid egresses the cavity.
3 more elements
Dependencies are inferred from the claim text.