Adhesive tape for tape automated bonding
AssigneeTomoegawa Paper Co., Ltd.
InventorsAkinori Sei, Yoshikazu Tsukamoto, Takashi Shiozawa, Tadahiro Ohishi, Hitoshi Narushima
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Abstract
An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.
Claims6
An adhesive tape for tape automated bonding (TAB) having an organic insulating film, an adhesive layer formed on the organic insulating film and a protective layer formed on the adhesive layer, said adhesive layer being a layer containing a polyamide resin having an amine value of at least 3 and a powdery inorganic filler having an average particle size of 0.1 to 3.0 .mu.m and being at least one oxide selected from the group consisting of silica, alumina, diatomaceous earth, titanium oxide, zinc oxide and magnesium oxide.
Dependencies are inferred from the claim text.