Method of forming a lift-off layer having controlled adhesion strength

A method of fabricating an emitter plate for use in a field emission display device, said method comprising the steps of:

• providing an insulating substrate;
• forming a first conductive layer on said insulating substrate;
• forming an insulating layer on said first conductive layer;
• forming a second conductive layer on said insulating layer;
• forming a plurality of apertures through said second conductive layer and through said insulating layer;
• forming a lift-off layer on said second conductive layer, said lift-off layer formed by an electroplating process wherein a plating bath comprises at least one metal capable of existing in two oxidation states;
• and
• wherein said plating process uses current densities between 4 and 8 mA/cm.sup.2, and further wherein said plating bath is saturated with oxygen.

A method of fabricating an emitter plate for use in a field emission display device, said method comprising the steps of:

• providing an insulating substrate;
• forming a first conductive layer on said insulating substrate;
• forming an insulating layer on said first conductive layer;
• forming a second conductive layer on said insulating layer;
• forming a plurality of apertures through said second conductive layer and through said insulating layer;
• forming a lift-off layer on said second conductive layer, said lift-off layer formed by an electroplating process wherein a plating bath comprises at least one metal capable of existing in two oxidation states;
• and
• wherein said plating bath has a pH between 2.6 and 3.1, and further wherein said plating bath is saturated with oxygen.