Power semiconductor module

A power semiconductor module in which a plurality of power semiconductor elements forming a bridge circuit are provided together with control circuits, comprising:

• a common casing which accommodates;
• metal base,
• main circuit section in which said plurality of semiconductor elements of said bridge circuit are mounted, in the form of chips, on a ceramic insulating board which is thermally coupled to said metal base, and which supports connecting conductors to which said semiconductor elements are connected, and
• a control circuit section in which said control circuits for said semiconductor elements are mounted on a wiring substrate, said wiring substrate comprising wiring conductors disposed on an insulating board, said wiring substrate being a multi-layer type wiring substrate, a lowest layer of said wiring substrate being employed as a shield conductor layer for said element control circuits,
• wherein
• said main circuit section being connected through bonding means to said control circuit section,
• input and output terminals of said bridge circuit are extended from said connecting conductors of said main circuit section, and
• connecting terminals of said control circuits which are to be connected to external equipment are extended from said wiring conductors.

A power semiconductor module in which a plurality of power semiconductor elements forming a bridge circuit are provided together with control circuits, comprising:

• a common casing which accommodates;
• metal base,
• main circuit section in which said plurality of semiconductor elements of said bridge circuit are mounted, in the form of chips, on a ceramic insulating board which is thermally coupled to said metal base, and which supports connecting conductors to which said semiconductor elements are connected, and
• a control circuit section in which said control circuits for said semiconductor elements are mounted on a wiring substrate, said control circuit section includes a bridge control circuit, and a multi-layer type wiring substrate is employed as said wiring substrate, so that wiring conductors buried therein are employed to connect said bridge control circuit to said element control circuits,
• wherein
• said main circuit section being connected through bonding means to said control circuit section,
• input and output terminals of said bridge circuit are extended from said connecting conductors of said main circuit section, and
• connecting terminals of said control circuits which are to be connected to external equipment are extended from said wiring conductors.