Thermal printhead, substrate for the same and method for making the substrate
AssigneeRohm Co., Ltd.
InventorsHideo Taniguchi, Shinobu Obata, Hiroshi Kinoshita
Life of this patent
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Abstract
A thermal printhead according to the present invention includes a substrate (2) of an insulating material having a substantially flat surface, a heating resistor (3) formed on the substrate (2) to form a plurality of heating dots, a conductor pattern (5, 6) formed on the substrate for electrical connection to the heating resistor (3), and driving elements mounted on the substrate (2) for selectively heating the heating dots via the conductor pattern (5, 6). The substrate (2) has, in its wall thickness, a hollow portion (10) extending along the heating resistor (3). The present invention also provides a method for making the substrate (2).
Claims11
A thermal printhead comprising:
- an integral substrate made only of a homogeneous insulating material, the substrate having a first flat surface and a second flat surface;
- heating resistor means formed on the first flat surface of the substrate to form a plurality of heating dots;
- a conductor pattern formed on the first flat surface of the substrate for electrical connection to the heating resistor;
- and
- driving means mounted on the first flat surface of the substrate for selectively heating the heating dots via the conductor pattern;
- wherein the substrate has, in its wall thickness, a hollow portion extending along the heating resistor means;
- and
- wherein the hollow portion is positioned between the first and second flat surfaces of the substrate, the hollow portion being closed upwardly and downwardly only by said insulating material of the substrate so that the hollow portion is formed entirely within the substrate.
A substrate for a thermal printhead, the substrate being made of only a homogeneous insulating material and having a first flat surface and a second flat surface, wherein the substrate has, in its wall thickness, a hollow portion extending in a strip from, and wherein the hollow portion is positioned between the first and second flat surfaces of the substrate, the hollow portion being closed upward and downward only by said insulating material of the substrate so that the hollow portion is formed entirely within the substrate.
Dependencies are inferred from the claim text.