Bottom lead semiconductor chip stack package
AssigneeLG Semicon Co., Ltd.
InventorYong Chan Kim
Life of this patent
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Abstract
A bottom lead semiconductor chip stack package which includes a first body and a second body. The first body includes a pair of lead frames, each lead frame having a first lead portion and a second lead portion. A protrusion enclosed in a solder extends from the first lead portion. The first body also includes a semiconductor chip containing chip pads disposed on the surface thereof, the chip pads being connected to the solder enclosed protrusions. The second body has substantially the same structural configurations as the first body and is reversely stacked relative to the first body such that the semiconductor chips are disposed in opposing relationship relative to each other. An adhesive attaches the lead frames of the first body to the corresponding lead frames of the second body.
Claims18
A bottom lead semiconductor chip stack package comprising:
- a first body including
- a pair of lead frames, each lead frame having a first lead portion and a second lead portion connected to said first lead portion,
- said first lead portion containing a protrusion extending therefrom,
- a semiconductor chip containing chip pads disposed on the surface thereof, said chip pads being connected to said protrusions,
- said body being encased in a molding compound such that a surface of each of said first lead portions is disposed outside said molding compound of said package and such that a surface of each of said second lead portions is disposed to extend outside said package;
- a second body having the same structural configurations as the first body and reversely stacked relative to the first body such that the semiconductor chips are disposed in opposing relationship relative to each other, and
- an adhesive for attaching the second lead portions of the first body to the corresponding second lead portions of the second body.
A bottom lead semiconductor chip stack package, comprising:
- a first body and a second body reversely stacked relative to each other, wherein each of the bodies includes
- lead frames having first leads containing a protrusion which extends from an upper surface thereof and second leads connected to said first leads,
- a semiconductor chip containing chip pads in a surface thereof which are aligned with and attached to the corresponding protrusions;
- an adhesive attaching the second leads of each of the first and second bodies to each other;
- and
- a molding compound filling the interior of each of the first and second bodies, enclosing the semiconductor chips therein, respectively, and sealing the chip stack package;
- and said first leads being disposed such that a surface of each of said first leads extends outside said molding compound of said package;
- and
- said second leads being disposed such that a surface of each of said second leads extends outside said molding compound of said package.
Dependencies are inferred from the claim text.