Circuit and method for heating an adhesive to package or rework a semiconductor die

A die support member comprising:

• a base having a surface with a localized region for direct attachment to a surface of a bare die;
• a die-attach heating circuit integral with the base in substantial registry with the localized region, the die-attach heating circuit generating heat in response to being energized thereby;
• a die located on the base in substantial registry with the localized region;
• a heat activated die-attach material interposed between a portion of the localized region of the base and the die;
• a die cover for enclosing the die, the die cover having a surface for attachment to the base at an interface between the base and the die cover;
• a die cover heating circuit interface with one of the base and the die cover in substantial registry with the interface therebetween, the die cover heating circuit generating heat in response to being energized;
• and
• heat activated attachment material interposed between the die cover heating circuit and the base.

An electronic device comprising:

• a bare integrated circuit die;
• and
• a die support member including:
• a base and a die cover for enclosing the bare die, the base having a surface with a localized die-attach region for direct attachment to a surface of the bare die, the die cover having a surface for attachment to the base at an interface therebetween via a heat-activated attachment material interposable between the surface of the die cover and the base at the interface therebetween;
• and
• a heating circuit integral with one of the base and the die cover in substantial registry with the interface between the base and the die cover, the heating circuit generating heat in response to being energized and thereby activating the attachment material.

A method of heating a heat-activated attachment material interposed between a bare die and a localized die-attach region on a surface of a base and the base and a die cover at an interface therebetween, the die cover and the base together enclosing a bare die attached to the base, the method comprising:

• providing a heating circuit integral with the base in substantial registry with its localized die-attach region;
• heating the die-attach material located between the base and the bare die by energizing the heating circuit;
• providing a heating circuit integral with either the die cover or the base in substantial registry with the interface therebetween;
• and
• heating the attachment material by energizing the heating circuit.