Disk bonding system
AssigneeOrigin Electric Company, Limited
InventorsToshio Kashiwagi, Katumi Yamaguchi, Masahiko Kotoyori, Hironobu Nishimura
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AssigneeOrigin Electric Company, Limited
InventorsToshio Kashiwagi, Katumi Yamaguchi, Masahiko Kotoyori, Hironobu Nishimura
Estimating the term…
A system for fabricating a bonded disk, comprises an adhesive supplying section for supplying a liquid adhesive on a first disk, a disk handling section for mating the first disk with a second disk, a spin coating section for spreading the adhesive between the first and second disks and a curing section for curing the adhesive. The disk handling section comprises a disk transfer mechanism for arranging the first and second disks in a confronting state in which the first and second disks confront each other and the adhesive supplied to the first disk is interposed between the first and second disks, and for transferring the first and second disks to the spin coating section so that the first and second disks remain in the confronting state.
A disk fabricating system for forming a single disk by bonding first and second disks, said system comprising:
A disk fabricating system for forming a single disk by bonding first and second disks, said system comprising:
A disk fabricating process for forming a single disk by bonding first and second disks, said system comprising:
A disk fabricating process for forming a single disk by bonding first and second disks, said system comprising:
Dependencies are inferred from the claim text.