Three-dimensional molded circuit board having interlocking connections

A circuit board assembly comprising:

• a first, a non-planar substrate having an upper surface and a lower surface, the first non-planar substrate including circuitry disposed on the upper surface and a plurality of protruding connectors having a first geometry integrally molded on the lower surface, the plurality of protruding connectors being metallized about the first geometry, wherein a metallized through hole is provided in each of the plurality of protruding connectors extending between the upper surface and the lower surface of the non-planar substrate, the metallized through hole connecting the circuitry on the upper surface with the metallized protruding connector on the lower surface;
• and
• a second substrate having an upper surface and a lower surface, the second substrate including a plurality of recessed connectors having a second geometry integrally molded on the upper surface and circuitry disposed on the lower surface, the plurality of recessed connectors being metallized about the second geometry, wherein a metallized through hole is provided in each of the plurality of recessed connectors extending between the upper surface and the lower surface of the second substrate, the metallized through hole of the second substrate connecting the metallized protruding connector on the upper surface of the second substrate with the circuitry on the lower surface, wherein the metallized through hole in each of the plurality of recessed connectors aligns with the metallized through hole in each of the corresponding plurality of protruding connectors;
• the geometries of the plurality of protruding connectors and the plurality of recessed connectors being different such that they deform when assembled to provide an electrical connection and a detachable physical connection.