Viscous fluid discharging apparatus for manufacturing semiconductors having a removable bubble capturing portion

A viscous fluid discharging mechanism discharging viscous fluid in a semiconductor manufacturing process, comprising:

• a viscous fluid temperature adjusting mechanism;
• a sealed joining portion sealed and joined to an outlet of the viscous fluid temperature adjusting mechanism;
• and
• a viscous fluid path removably connected to the sealed joining portion moving the viscous fluid to a viscous fluid discharging outlet in a sealed state, the viscous fluid path having
• a means for capturing air bubbles in the viscous fluid path comprising a furrowed tube capturing air bubbles from within the viscous fluid;
• wherein the viscous fluid path may be removed, wherein the means for capturing air bubbles may be cleaned.

A viscous fluid discharging apparatus discharging viscous fluid in a semiconductor manufacturing process, comprising:

• a viscous fluid storage container holding said viscous fluid;
• a pump pumping the viscous fluid from the viscous fluid storage container;
• a filter coupled to the pump filtering the viscous fluid;
• a viscous fluid discharging mechanism coupled to the filter receiving filtered viscous fluid, the viscous fluid discharging mechanism having a connecting portion removably coupling to a means for capturing air bubbles said means for capturing air bubbles having an outlet discharging the viscous fluid, wherein the means for capturing air bubbles comprises a furrowed tube shaped to have an upper portion capturing air bubbles in furrows of the furrowed tube, wherein the viscous fluid discharging mechanism may be removed, wherein the means for capturing air bubbles may be cleaned.