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US 5,931,222 AGranted
Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
AssigneeInternational Business Machines Corporation
InventorsHilton T. Toy, David L. Edwards, Da-Yuan Shih, Ajay P. Giri
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Abstract
A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.
Claims13
A heat sink assembly, comprising:
- a multi-chip module having a substrate and at least one integrated circuit chip mounted on a first surface of said substrate;
- a cap enclosing said at least one integrated circuit chip, said cap comprising a substrate cap structure containing copper and a metallic upper, exterior cap surface layer comprising nickel;
- means for providing thermal transmission between said at least one integrated circuit chip and said cap;
- a polymeric adhesive layer comprising a silicone elastomeric material;
- a thin adherent metal film comprising chromium located between and in direct contact with both said exterior cap surface layer and said polymeric adhesive layer, said thin adherant metal film having a thickness effective to bond said exterior cap surface layer to said polymeric adhesive layer, wherein said thin adherant metal film has a thickness of from 50 .ANG.ngstroms to 10,000 .ANG.ngstroms;
- and
- a heat sink bonded to said polymeric adhesive layer.
4 more elements
Dependencies are inferred from the claim text.