Printed lumped element stripline circuit ground-signal-ground structure

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer;
• a third dielectric substrate laminated onto the second dielectric substrate;
• and
• a third ground plane deposited onto the third dielectric substrate on a side opposite the signal carrying metal layer.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer,
• wherein the lumped element printed circuit includes at least one printed interdigital capacitor.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer, wherein the lumped element printed circuit includes at least one resistor.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dieletric substate on a side opposite the signal carrying metal layer,
• wherein the lumped element printed circuit is a three-port coupler.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer, wherein the second ground plane forms at least one dielectric bridge.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer,
• at least one connecting plated-through via hole drilled into the second dielectric substrate;
• and
• at least one dielectric bridge formed in the second ground plane and connected to at least one printed circuit element formed in the signal carrying layer by the connecting plated-through via hole.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer,
• wherein the first and second dielectric substrates are made of materials having different dielectric constants.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer,
• wherein the lumped element printed circuit includes at least one printed spiral inductor comprising:
• an input port;
• an output port;
• a plurality of spiral arms connected to the input port;
• a first connecting plated-through via hole connected to the spiral arms;
• a dielectric bridge connected to the first connecting plated-through via hole;
• and
• a second connecting plated-through via hole connected between the dielectric bridge and the output port.

A stripline structure for implementing lumped element printed circuits having a ground-signal-ground architecture comprising:

• a first dielectric substrate;
• a signal carrying metal layer deposited onto the first substrate, in which a lumped element printed circuit is formed;
• a second dielectric substrate laminated onto the first dielectric substrate;
• a first ground plane deposited onto the first dielectric substrate on a side opposite the signal carrying metal layer;
• and
• a second ground plane deposited onto the second dielectric substrate on a side opposite the signal carrying metal layer,
• wherein the lumped element printed circuit operates over a frequency range of 200 MHZ to 4 GHz.