Compliant integrated circuit package and method of fabricating the same

A method of fabricating a semiconductor chip package, comprising the steps of:

• providing a thermally conductive protective structure having front and back sides, a forward direction outwardly away from the front side of the structure and a rearward direction opposite to said forward direction, the protective structure defining an indentation open to the front of the structure and a flange surface at least partially surrounding the opening of the indentation and facing in said forward direction, said indentation extending into the protective structure in said rearward direction, said protective structure having an indentation rear surface at the rear of said indentation;
• disposing a chip within the indentation, the chip having a front surface bearing a plurality of contacts and a back surface, the front surface of the chip facing in said forward direction, the back surface of said chip facing said indentation rear surface;
• placing a first flexible dielectric circuit film having terminals thereon overlying the flange surface of the protective structure, each terminal being electrically connected to one contact on the chip;
• disposing a compliant material between the first film and the flange surface;
• and
• sealing the front of the protective structure to protect the chip against environmental contamination, wherein the terminals are exposed at the front of the protective structure and are independently displaceable in said rearward direction towards the front side of the protective structure.